Chomerics THERM-A-GAP thermal gels – The perfect gel for every application
The THERM-A-GAP gels from Parker Chomerics are single-component, dispensable and fully cured, thermally conductive gels for bridging gaps and the safe thermal connection of components to heat sinks.
Depending on the application, thermal conductivity values from 2.4 to 7.5 W/m-K are available in GEL 20, GEL 30, GEL 45, GEL 60HF and GEL 75. For applications with high flow rates, the GEL 60HF has been developed. The exact technical data can be found in the table.
The advantages of the gels are especially in the following areas:
– Elimination of time-consuming manual assembly and reduction of installation and manufacturing costs.
– No mixing or curing required.
– Low thermal impedance for thin and thick gaps.
– Reduction of stress on components due to large bending capacity at low pressure.
– Long shelf life.
This makes the gels suitable for a variety of different applications such as:
– Electronic control units for motor vehicles
– Power supplies & semiconductors
– Memory & power modules
– Microprocessors/Graphics Processors
– Flat panel displays & consumer electronics
An overview of our Thermal Gels incl. data sheets can be found here.
We will be happy to help you with the selection or advise you which material makes the most sense in your case. Please feel free to contact our team directly here!
