Increasing technical requirements of the electronics industry for electrical and electronic devices place the highest demands on thermally conductive materials.
So-called gap fillers offer a quick solution for closing the gap, for which conventional thermal conductive films or thermal conductive pastes are no longer sufficient.

The family of the Thermal Interface Gap Filler (“Therm-a-gap”) from Parker Chomerics fill large and uneven spaces from 0.25 mm.

The increasing technical requirements implemented by the electronics industry regarding electrical and electronic devices place the highest demands on thermally conductive materials.
The so-called ‘gap fillers’ provide a quick solution for sealing gaps when conventional thermally conductive foils or thermally conductive pastes no longer suffice.

Parker Chomerics’ “Therm-a-gap” family (thermal interface gap fillers) fills large and uneven spaces from 0.25 mm.