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Thermal conductive pastes and thermal conductive gels
We can provide you with thermally conductive pastes for pressure-sensitive applications.
Very soft, thicker and compressible ceramic-filled polymers or elastomers have been developed as compressible thermally conductive pastes that compress into large gaps inbetween components and heat sinks or to compensate for unevenness, reduce or eliminate unevenness on surfaces and gaps inbetween specific components. These polymer or elastomer based-materials are filled with ceramics and their excellent malleability makes them ideal for processing under minimal pressure.
These thermally conductive pastes can easily be applied to components in complex geometries and they will bond accordingly.
All of the compounds are available in ready-to-use cartridges that eliminate the need for degassing, mixing and weighing.
THERMAL CONDUCTIVE PASTES
Thermally conductive gels are extremely flexible, single-component compounds that are already fully cross-linked.
The cross-linked gel structure provides excellent long-term thermal stability and reliable performance. This unique material produces considerably less mechanical stress on sensitive components when compared to gap fillers.
They are ideal for filling varying gaps inbetween multiple components and common heat sinks. There is no longer any need to use different gap fillers that have different material thicknesses.
THERMAL CONDUCTIVE GELS
Product inquiry
If you need more information or an offer on Thermal conductive pastes and thermal conductive gels, just fill out the contact form. We are also happy to send you product samples. We look forward to hearing from you and will get back to you as soon as possible!
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E. S. Electronic Service GmbH
Hohe Straße 3
61231 Bad Nauheim
Phone: +49 (0) 6032 9636-0
Fax: +49 (0) 6032 9636-49
Email: info@electronic-service.de
ABOUT US
The E.S. Electronic Service GmbH produces and markets customer-oriented solutions worldwide. In doing so, we concentrate our resources on electronic components, materials with a focus on EMI shielding, heat conduction, as well as noise filters and absorbers.
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